Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Authors: Way Kuo – Taeho Kim – Wei-Ting Kary Chien
ISBN-10: 0792381076
ISBN-13: 9780792381075
Edition: 1998
Release: January 31, 1998
Hardcover: 394 pages
List Price $222.00
Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
未经允许不得转载:电子书百科大全 » Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
相关推荐
Mathematical Methods and Applications of Scattering Theory
Charged Particle Traps II: Applications
Artificial Intelligence in the Energy Industry: Theory, Case Studies, and Applications
Smart Construction and Industry 5.0: Renewable Energy Integration, Digitalization, Robotics, and Sustainability
Advanced Techniques for Optimal Sizing of Analog Integrated Circuits: Quantum Computing, Machine Learning, and Bio-inspired Optimization
Technical Textile Yas
Green Electronic and RF Technologies for Communications, IoT, and Medical Systems
Virtual and Augmented Reality: Fundamentals and Applications
电子书百科大全