CMOS Past, Present and Future (Woodhead Publishing Series in Electronic and Optical Materials)

CMOS Past, Present and Future (Woodhead Publishing Series in Electronic and Optical Materials)
by: Henry Radamson (Author),Eddy Simoen(Author),Jun Luo(Author),Chao Zhao(Author)&1more
Publisher: Woodhead Publishing
Edition: 1st
Publication Date: 2018/4/19
Language: English
Print Length: 278 pages
ISBN-10: 0081021399
ISBN-13: 9780081021392
Book Description
CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends.The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.Addresses challenges and opportunities for the use of CMOSCovers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic componentsProvides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities
About the Author
CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends.The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.Addresses challenges and opportunities for the use of CMOSCovers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic componentsProvides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities Read more