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Materials for High-Density Electronic Packaging and Intercon

2015-06-02 分类：工程评论(0)

Materials for High-Density Electronic Packaging and Intercon
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Author: Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council
Publisher: National Academies
Pages: 156
Publication: 1990-01-01
ISBN-10: 030904233X
ISBN-13: 9780309042338

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