Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Authors: Li, Er-Ping
Get this book Contact Email: girro@qq.com
Publisher: Wiley(2012/3/19)
Edition: 1
Language: English
ISBN-13: 9780470623466
e-ISBN-13: 9781118166741

资源下载资源下载价格10立即购买
1111

未经允许不得转载:电子书百科大全 » Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

评论 0

评论前必须登录!

登陆 注册