Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Authors: Li, Er-Ping
Get this book Contact Email: girro@qq.com
Publisher: Wiley(2012/3/19)
Edition: 1
Language: English
ISBN-13: 9780470623466
e-ISBN-13: 9781118166741
未经允许不得转载:电子书百科大全 » Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
评论前必须登录!
登陆 注册