Electrical Modeling and Design for 3D System Integration
3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Author: Li Er-Ping
Get this book Contact Email: girro@qq.com
Hardcover: 390 pages
Publisher: John Wiley & Sons (March 19, 2012)
Language: English
ISBN-10: 0470623462
ISBN-13: 9780470623466
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